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Design and Operation of an Integrated High-Temperature Measurement Structure

Boianceanu, Cristian; Simon, Dan Ionut; Costachescu et al.

IEEE Transactions on Semiconductor Manufacturing. 2012;25(4):542-548. DOI:10.1109/tsm.2012.2205166

Improved Performance of 4H-SiC PiN Diodes Using a Novel Combined High Temperature Oxidation and Annealing Process

Fisher, Craig A.; Jennings, Michael R.; Sharma et al.

IEEE Transactions on Semiconductor Manufacturing. 2014;27(3):443-451. DOI:10.1109/tsm.2014.2336701

Impact of Recipe Restrictions on Photolithography Toolsets in an ASIC Fabrication Environment

Kabak, Kamil Erkan; Heavey, Cathal; Corbett et al.

IEEE Transactions on Semiconductor Manufacturing. 2013;26(1):53-68. DOI:10.1109/tsm.2012.2220572

Random Yield Prediction Based on a Stochastic Layout Sensitivity Model

Ghaida, R.S.; Doniger, K.; Zarkesh-Ha et al.

IEEE Transactions on Semiconductor Manufacturing. 2009;22(3):329-337. DOI:10.1109/tsm.2009.2024821

Critical Dimension Uniformity Via Real-Time Photoresist Thickness Control

Weng Khuen Ho, ; Tay, A.; Ming Chen et al.

IEEE Transactions on Semiconductor Manufacturing. 2007;20(4):376-380. DOI:10.1109/tsm.2007.907610

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