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Ni/Cu/Ag plated contacts: A study of resistivity and contact adhesion for crystalline-Si solar cells

Ni/Cu/Ag镀层触点：晶体硅太阳能电池的电阻率和触点附着力研究

ur Rehman, Atteq; Lee, Sang Hee; Bhopal et al.

Electronic Materials Letters. 2016;12(4):439-444. DOI:10.1007/s13391-016-4003-2

Electrochemical properties of rapidly solidified Si-Ti-Ni(-Cu) base anode for Li-ion rechargeable batteries

锂离子二次电池快速凝固Si-Ti-Ni（-Cu）基阳极的电化学性能

Hye Jin Kwon,Keun Yong Sohn,Won-Wook Park

Electronic Materials Letters. 2013;9(6):859-863. DOI:10.1007/s13391-013-6030-6

Current trends in studies on reverse-mode polymer dispersed liquid-crystal films — A review

反模聚合物分散液晶薄膜研究现状——综述

Farzana Ahmad,M. Jamil,Y. J. Jeon

Electronic Materials Letters. 2014;10(4):679-692. DOI:10.1007/s13391-013-3279-8

Initial corrosion behavior of a copper-clad plate in typical outdoor atmospheric environments

典型室外大气环境中覆铜板的初始腐蚀行为

Yi, Pan; Xiao, Kui; Ding et al.

Electronic Materials Letters. 2016;12(1):163-170. DOI:10.1007/s13391-015-5309-1

Influence of Mn on crystal structure and thermoelectric properties of GeTe compounds

Mn对GeTe化合物晶体结构和热电性能的影响

J. K. Lee,M. W. Oh,B. S. Kim et al.

Electronic Materials Letters. 2014;10(4):813-817. DOI:10.1007/s13391-014-4149-8

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